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SHENZHEN QKING TECHNOLOGY DEVELOPMENT CO., LTD.
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Hardware Industrial Zone, Southern China international industrial city, Pinghu
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G4 G9 lamp beads encapsulation adhesive sealant G4 G9 glue

G4G9 lampbeadsencapsulation adhesivesealantG4G9 glue

Product description:

QK-6852-2by the A agent andBagent,which belongs to the 1.42refractive indexsilica gel,particularly suitable forcorn lightpotting,product transparency,rows offoam,curingcycle short,demoulding,high and low temperature resistanceand good effect.

Technical parameters:

AB

Before curingappearance colorless transparentliquidcolorless transparent liquid

The viscosity of 1200cps6000cps

The mixed proportion of 1:1

Mixedviscosity of 3500cps

The curing conditionsof 80 ℃+150℃ /30minutes/30 minutes

Mixedtime available for>5 hours

After curingtransparent appearance

The hardness of 55A

A refractive index of 1.42

Guidelines on the use of:

1 A,Btwo groupspidedaccording to the mass ratio of 1:1to use,recommended operatingproductionin drydust-freeenvironment.

2planetarygravity mixer(since therevolutionstirring defoamingmachine)can be evenly mixedglue,orvacuumat room temperatureto 100Padegreescan be usedto removeair bubbles.

3pointbefore themoldsprayed with release agent,inplastic injectionbefore,pleaseput cornlampat 150 ℃preheated 30minutes aboveexcept tide,as soon as possible in thelightnot reabsorption of moisturebeforedispensing.

4after glue injectionsample should beplacedat room temperaturefor 30 minutes,until nobubble.

5in 80℃oven for 30minutes,then immediatelytemperature150 ℃ for30 minutescan becompletely cured,and thendie.

6without the use ofglueinto the clean,airtight containers,placed on thetablefor convenient use.

Cornlamp packageglue,G4G9 cornlamppackaging adhesive,molding plushigh index G4G9 cornlamppackaging adhesive

Matters needing attention:

1 QK-6852-2ABplussilicone,temperaturehas great influence on thecuring rate,adhesiveshould pay attention tothe speed and time of stirringmachine,controltemperature should not exceed 35℃.

2 QK-6852-2ABaddition siliconeelastomer,shouldavoid contact withN,P,S,alkynes anddienes andlead,tin,cadmium,mercuryand heavy metals,in order to preventhardeningof incomplete ornothardened,bysealingsurfacemust becleanbeforeinpotting.

3silica gelmode of operationis not the same,will producedifferentresults,such asthe bubble,interlayer,degumming,cracked gumphenomenon,pleaseavoid causingfactors,orconsult the relevantpersonnel.

4 the vacuumequipment is bestis an opensystem,andnot with theepoxy resinmixture,lest causecuringobstacles,the idealis to set up anorganicsilica geldedicatedproduction line.

5need to use themixing containerfor silica gelandstir bar,wearing rubber glovestoavoidcontact withsilica gel.

6 forsiliconeis not easy todefoamingsake,involved inplastic injectionof gasorclearancetimedifferenceproduces bubbles,pleasestart from room temperaturestageheatingto helppurge bubble.

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